PVTIME – On April 8, Qingdao Gaoce Technology Co., Ltd.(688556.SH)(hereinafter referred to as Gaoce Technology), a company specialized in R&D, production and sales of cutting equipment for hard and brittle materials and cutting tools, announced that it signed a Investment Agreement with the Management Committee of High-Tech Industrial Development Zone in Jianhu, Yancheng City, Jiangsu Province, China, for the construction of the Phase II of the 10 GW Large-Size Photovoltaic Silicon Wafer Project, with an estimated total investment of 700 million yuan.
Yancheng Gaoce New Energy Technology Co., Ltd., a wholly-owned subsidiary of Gaoce Technology, will be in charge of the project. The project was originally planned to be implemented in two phases, which each was expected to reach a production capacity of 5GW silicon wafer slicing every year. However the two will be combined into one as the project is currently progressing well and to meet the demand of the market. In addition, the construction period of the whole plant will be within 12 months.
According to the announcement, neither substantial changes to the project is involved nor significant negative impact on the Gaoce Technology will occur regarding to the above adjustments.
(hereinafter referred to as Gaoce Technology), a company specialized in R&D, production and sales of cutting equipment for hard and brittle materials…){kind=link}